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NP Series
PACKAGE DIMENSIONS
S
A
SMB
CASE 403C ? 01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
INCHES
MILLIMETERS
D
B
DIM MIN MAX
A 0.160 0.180
B
0.130 0.150
C
0.075 0.095
D
0.077 0.083
H
0.0020 0.0060
J
0.006 0.012
K
0.030 0.050
P
0.020 REF
MIN MAX
4.06 4.57
3.30 3.81
1.90 2.41
1.96 2.11
0.051 0.152
0.15 0.30
0.76 1.27
0.51 REF
C
S
0.205 0.220
5.21 5.59
K
P
J
H
SOLDERING FOOTPRINT*
2 .26 1
0.089
2.74 3
0.108
2.15 9
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NP0640S/D
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